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摘要: 现有视觉缺陷检测技术通常基于传统电荷耦合器件(Charge-coupled device, CCD)或互补金属氧化物半导体(Complementary metal-oxide-semiconductor, CMOS)相机进行缺陷成像和后端检测算法开发. 然而, 现有技术存在成像速度慢、动态范围小、背景干扰大等问题, 难以实现对高反光产品表面弱小瑕疵的快速检测. 针对上述挑战, 创新性地提出了一套基于动态视觉传感器(Dynamic vision sensor, DVS)的缺陷检测新模式, 以实现对具有高反光特性的铝基盘片表面缺陷的高效检测. DVS是一种新型的仿生视觉传感器, 具有成像速度快、动态范围大、运动目标捕捉能力强等优势. 首先开展了面向铝基盘片高反光表面弱小瑕疵的DVS成像实验, 并分析总结了DVS缺陷成像的特性与优势. 随后, 构建了第一个基于DVS的缺陷检测数据集(Event-based defect detection dataset, EDD-10k), 包含划痕、点痕、污渍三类常见缺陷类型. 最后, 针对缺陷形态多变、纹理稀疏、噪声干扰等问题, 提出了一种基于时序不规则特征聚合框架的DVS缺陷检测算法(Temporal irregular feature aggregation framework for event-based defect detection, TIFF-EDD), 实现对缺陷目标的有效检测.Abstract: Current visual defect detection technologies usually rely on conventional charge-coupled device (CCD) or complementary metal-oxide-semiconductor (CMOS) cameras for defect imaging and the development of backend detection algorithms. However, these technologies encounter challenges such as slow imaging speed, limited dynamic range, and significant background interference, which hinder the rapid detection of minor defects on highly reflective product surfaces. To address these challenges, we innovatively propose a new defect detection mode based on dynamic vision sensor (DVS) to achieve efficient defect detection on the highly reflective surfaces of aluminum disks. DVS is a novel bio-inspired visual sensor with advantages such as fast imaging speed, high dynamic range, and excellent ability to capture moving objects. First, we conduct DVS imaging experiments for minor defects on the highly reflective surfaces of aluminum disk and analyze the characteristics and advantages of DVS on defect imaging. Then, we establish the first event-based defect detection dataset (EDD-10k) based on DVS, including three common defect types: Scratch, point and stain. Finally, to address the issues such as varying defect shapes, sparse textures, and noise interference, we propose a temporal irregular feature aggregation framework for event-based defect detection (TIFF-EDD), and realize the effective detection of defect targets.
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图 2 事件产生数量与光强变化大小的关系示意图 ((a) 当$\Delta t$时间内光强变化小时, 产生的事件数量少; (b) 当$\Delta t$ 时间内光强变化大时, 产生的事件数量也相应变多)
Fig. 2 Relationship diagram between the number of generated events and the magnitude of light intensity change ((a) When the change of light intensity in $\Delta t$ is small, fewer events are generated; (b) When the change of light intensity in $\Delta t$ is large, the number of generated events increases accordingly)
表 1 事件流在训练集和测试集中的数量分布
Table 1 Quantity distribution of event streams in the training set and testing set
类别 事件流总数 训练集事件流数量 测试集事件流数量 点痕 35 27 8 划痕 39 30 9 污渍 44 34 10 合格 4 2 2 表 2 EDD-10k数据集中每一类缺陷标签的数量
Table 2 The number of labels for each defect category in EDD-10k dataset
类别 事件流总数 训练集事件流数量 测试集事件流数量 点痕 2865 2381 484 划痕 2159 1781 378 污渍 4070 3060 1010 合格 9094 7222 1872 表 3 与其他算法在EDD-10k数据集上的对比实验
Table 3 Comparison experiments with other algorithms on the EDD-10k dataset
方法 mAP@0.4 AP@点痕 AP@划痕 AP@污渍 Faster R-CNN[41] 0.210 0.000 0.536 0.095 YOLOv5 0.569 0.393 0.756 0.559 YOLOv7[42] 0.543 0.471 0.644 0.514 RDN[47] 0.512 0.553 0.476 0.507 MEGA[48] 0.401 0.356 0.509 0.349 YOLOV[49] 0.537 0.112 0.628 0.670 SSD-event[40] 0.236 0.087 0.626 0.138 SODformer-event[25] 0.394 0.363 0.161 0.495 TIFF-EDD 0.617 0.512 0.701 0.639 表 4 在EDD-10k数据集上的消融实验结果
Table 4 Ablation experimental results on the EDD-10k dataset
基线 MIFE CTAA VFLoss DPF mAP@0.4 TIFF-B $\checkmark$ 0.577 TIFF-MIFE $\checkmark$ $\checkmark$ 0.590 TIFF-CTAA $\checkmark$ $\checkmark$ $\checkmark$ 0.607 TIFF-VF $\checkmark$ $\checkmark$ $\checkmark$ $\checkmark$ 0.612 TIFF-EDD $\checkmark$ $\checkmark$ $\checkmark$ $\checkmark$ $\checkmark$ 0.617 -
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