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摘要: 本文系统回顾美国、欧洲及我国在宇航用处理器领域的技术演进, 重点分析了基于PowerPC架构的美国代表性处理器产品以及采用SPARC架构的欧洲与我国典型处理器方案. 研究揭示, 未来宇航用处理器的发展将显著分化为通用型与智能型两大技术路线. 通用型宇航用处理器将呈现高性能(如提升多核并行计算能力)、高集成度(如实现系统级芯片SoC)、高可靠性(如强化抗辐射设计)及低功耗的协同发展趋势; 而智能型处理器则将侧重于提升在轨实时智能信息处理能力.Abstract: This paper provides a systematic review of the technological evolution of aerospace processors in the United States, Europe, and China. It primarily analyzes representative U.S. processor products based on the PowerPC architecture, as well as typical European and Chinese processor solutions that utilize the SPARC architecture. The research identifies that the future development of aerospace processors is expected to diverge into two main technical directions: general-purpose and intelligent processors. General-purpose aerospace processors will follow a coordinated trend of increased performance (such as enhanced multi-core parallel computing capabilities), higher integration (such as system-on-chip designs), improved reliability (such as enhanced radiation-hardened designs), and reduced power consumption. In contrast, intelligent processors will concentrate on advancing real-time intelligent information processing capabilities for space applications.
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Key words:
- aerospace processor /
- processor architecture /
- PowerPC /
- SPARC /
- RISC-V
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表 1 美国宇航用处理器各指标对比
Table 1 Comparison of various indicators of U.S. aerospace processor
处理器 RAD 6000 RAD 750 RAD 5510 RAD 5545 架构 PowerPC PowerPC PowerPC PowerPC 内核 RS6000 Power 750 Power e5500 Power e5500 主频 33 MHz 132–233 MHz 466 MHz 466 MHz 核心数量 1 1 1 4 位数 32 32 64 64 TID 100K rad(Si) 1M rad(Si) 1M rad(Si) 1M rad(Si) SEU(错误/(器件·天)) $ \leq $ 7.4E $ - $ 10 $ \leq $ 1.6E $ - $ 10 $ \leq $ 8E $ - $ 14 $ \leq $ 8E $ - $ 14 SEL - - - - 性能 35 MIPS 200–400 MIPS 1.4 GOPS 4.6 GOPS 功耗 - 5 W 11.5 W 17.7 W 表 2 欧洲宇航用处理器各指标对比
Table 2 Comparison of various indicators of European aerospace processor
处理器 MA31750 TSC695F AT697F GR740 NOEL-V 架构 - SPARC V7 SPARC V8 SPARC V8 RISC-V 主频 25 MHz 25 MHz 100 MHz 250MHz - 内核 - ERC32 LEON2 LEON4-FT - 核心数量 1 1 1 4 4 流水线 - 4 5 7 7 位数 32 32 32 32 64 性能(Dhrystone/core) - 25 MIPS 86 MIPS 1.7DMIPS - TID $ \geq $ 300K $ \geq $ 300K $ \geq $ 300K $ \geq $ 300K - SEU(errors/card-day) $ \leq $ 6E $ - $ 7 $ \leq $ 3E $ - $ 8 $ \leq $ 1E $ - $ 5 $ \leq $ 1E $ - $ 5 - SEL - $ \geq $ 100 $ \geq $ 70 ≥ 125 - 功耗 - $ \leq $ 1.5 W $ \leq $ 1 W ≤ 1.8W - 工艺 - 500 nm (MG2RT) 180 nm (CMOS) 65nm(CMOS) - 表 3 龙芯系列产品架构指标
Table 3 Loongson series product architecture indicators
处理器 1J 1F04 1F300 1E03 1E300 1E1000 架构 MIPS MIPS MIPS MIPS MIPS MIPS L1 Cache - - - 8K+8K 16K+16K 32K+32K L2 Cache - - - - - 1M 核心 1 1 1 1 1 2 主频 10 MHz 33 MHz 100 MHz 100 MHz 200 MHz 1 GHz 内存接口 - SRAM SRAM、SDRAM SDRAM SDRAM DDR2/3 SpaceWire - - $ \checkmark $ - - $ \checkmark $ 1553 - $ \checkmark $ $ \checkmark $ - - - PCI - $ \checkmark $ $ \checkmark $ $ \checkmark $ $ \checkmark $ - UART $ \checkmark $ $ \checkmark $ $ \checkmark $ $ \checkmark $ $ \checkmark $ $ \checkmark $ I $ ^{2} $ C $ \checkmark $ - - $ \checkmark $ $ \checkmark $ $ \checkmark $ SPI $ \checkmark $ - - $ \checkmark $ $ \checkmark $ $ \checkmark $ 表 4 我国宇航用处理器各指标对比
Table 4 Comparison of various indicators of China’s aerospace processor
处理器 SoC2008 SoC2012 BM3803MGRH LS1E LS1F 架构 SPARC V8 SPARC V8 SPARC V8 MIPS MIPS 主频 100 MHz 100 MHz 100 MHz 200 MHz 100 MHz 核心数量 1 4 1 1 1 流水线 7 7 7 7 7 性能 0.86 DMIPS 3 DMIPS 0.85 DMIPS - - TID $ \geq $ 100K $ \geq $ 200K $ \geq $ 100K $ \geq $ 300K $ \geq $ 100K SEU $ \leq $ 1E $ - $ 7 $ \leq $ 3E $ - $ 8 $ \leq $ 5E $ - $ 5 $ \leq $ 6.5E $ - $ 5 $ \leq $ 1E $ - $ 5 SEL $ \geq $ 100 $ \geq $ 100 $ \geq $ 75 $ \geq $ 75 $ \geq $ 75 功耗 $ \leq $ 0.7 W $ \leq $ 1 W $ \leq $ 1 W $ \leq $ 3 W $ \leq $ 3 W 工艺 130 nm (CMOS) 130 nm (CMOS) - 180 nm (CMOS) 180 nm (CMOS) -
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